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HOME ＞ Technologies & Products ＞ Laser Processing Systems ＞ Ultra-High-Precision Drilling
Ultra-High-Precision Drilling
Ultra-high-precision drilling made possible using a beam rotator and galvano scanner manufactured in-house
Equipment external view
Strengths
■ Straight hole drilling
■ Fine drilling with excellent circularity, high degree of freedom
■ Round holes, square holes, holes with special shapes
■ Control over hole diameter, taper at the entry and exit sides
■ Processing position accuracy:<1μm
Target materials
Resin, Ceramic (Silicon nitride / Silicon carbide), Polyimide, SUS, Sapphire substrate, Artificial diamond
Equipment features
Control of the radius of rotation and the angle of incidence with a beam rotator enables a variety of hole shapes
Beam rotator manufactured in-house
Examples
Small-hole drilling
Entry side
Silicon nitride
Thickness 0.25 mm
Hole dia. 20 μm
Pitch 26 μm
Machining speed 1.2 sec/hole
Exit side
Beam entrance
Silicon nitride
Thickness 0.25 mm
Square hole size 20 μm on a side
Pitch 28 μm
Machining speed 1.4 sec/hole
Beam exit
Narrow-pitch hole drilling
Entry side
Silicon nitride
Thickness 0.25 mm
Hole dia. 50 μm
Pitch / Wall 58 μm / 8 μm
Processing time 2.5 sec/hole
Exit side
Entry side
Silicon nitride
Thickness 0.25 mm
Square hole size 50 μm on a side
Pitch / Wall 62 μm / 12 μm
Machining speed 5.0 sec/hole
Exit side
Straight hole drill machining
Cross Section
Super engineering plastic (LCP material)
Thickness 0.4 mm
Hole dia. 250 μm
Pitch 270 μm
Machining speed 3 sec/hole
Cross Section
Super engineering plastic (LCP material)
Hole dia. 15 μm
Pitch 27 μm
Machining speed 1.5 sec/hole
Special tapered hole machining
Cross Section
Cross Section
