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Laser Precision Cutting Equipment

The optimal combination of an oscillator with an optical system enables the processing of difficult-to-process materials

Equipment external view

Equipment information

■ An abundant lineup of laser oscillators and optical systems
■ Makes it possible to appropriately configure conditions for processing-resistant materials
■ Selectable UV, Gr, and IR lasers

Target materials

Resin, Sapphire, Alumina, FPC board, SUS, Diamond

Processing examples

Alumina

Entry side

 

Cross section

Thickness 0.19 mm

Machining speed 500 mm/sec

High-performance film

Entry side

 

Cross section

Thickness 50 μm

Machining speed 65 mm/sec

Sapphire

Entry side

 

Cross section

Thickness 0.37 mm

Machining speed 5 mm/sec

SUS430

Entry side

 

Cross section

Thickness 0.15 mm

Machining speed 100 mm/sec