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HOME ＞ Technologies & Products ＞ Laser Processing Systems ＞ Laser Scribing Equipment
Laser Scribing Equipment
Realizes high-quality, high-speed processing in combination with optimal processing systems
Equipment information
■ Construction of optimal processing systems
■ High throughput
■ All manner of cross-section shape processing is possible
■ Selectable UV, Gr, and IR laser
Target materials
Silicon nitride, Silicon carbide, Green sheets, Alumina
Processing examples
Silicon nitride
Entry side
Groove cross section
Thickness 0.32 mm
Machining speed 167 mm/sec
Width 96 μm
Depth 153 μm
Green Sheet
Beam entrance
Groove cross section
Thickness 0.30 mm
Machining speed 125 mm/sec
Width 26 μm
Depth 230 μm
Alumina
Beam entrance
Groove cross section
Thickness 0.18 mm
Machining speed 50 mm/sec
Width 20 μm
Depth 60 μm
